Investigation the effectiveness of using heat pipe on the temperature uniformity distribution over the SC equipment panel

Document Type : Original Article

Authors

1 Space technology Centre, Cairo, Egypt.

2 Prof. Dr., Faculty of Engineering, Tanta University, Tanta, Egypt.

3 Military Technical College, Cairo, Egypt.

10.1088/1757-899X/610/1/012090

Abstract

The heat pipe is a thermal device which allows an efficient transport of thermal energy. In this paper parametric study has been achieved to investigate the importance of using heat pipes about the uniformity of the temperature distribution over the equipment panel of the spacecraft (SC), which is a part of a real thermal control subsystem. Heat pipe analytical solution is used as a guide for design and geometrical parameters selection. The design of SC equipment panel radiator and a parametric study of the heat pipe are obtained numerically using Thermal desk top program (TDT). The space environment and the spacecraft operational conditions have been simulated by TDT program. Heat pipe prevents the hot spots which can be occurred due to the different equipment heat dissipation. The selected heat pipe design approach incorporates a conservative reliability philosophy and provides maximum operational flexibility

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